SK Hynix Starts 2.5D Packaging R&D With Intel as EMIB Adoption Lifts Shares 11%
Updated
Updated · MarketWatch · May 11
SK Hynix Starts 2.5D Packaging R&D With Intel as EMIB Adoption Lifts Shares 11%
12 articles · Updated · MarketWatch · May 11
SK Hynix has reportedly begun joint 2.5D packaging R&D with Intel and is weighing adoption of Intel’s EMIB technology for high-bandwidth-memory integration.
11% gains in SK Hynix shares and an early 4% rise in Intel reflected investor optimism that Intel’s foundry and advanced-packaging business is winning another potential customer.
A severe global packaging shortage has pushed chipmakers to seek alternatives to TSMC’s constrained CoWoS capacity, giving Intel’s EMIB and rivals such as Amkor more traction.
13.7% of global 2.5D packaging capacity belongs to Intel today versus TSMC’s 69.8%, though Intel has said customer engagement is strong and packaging deals could bring in billions annually.
How will Intel's foundry revival, backed by Apple, reshape the global chip landscape long dominated by Taiwan?
Can Intel's new manufacturing technology truly deliver the performance and scale required by giants like Apple and Tesla?