TSMC Packaging Overflow Sends AI Chip Orders to Intel and 4 Taiwan Firms
Updated
Updated · Wccftech · Jul 12
TSMC Packaging Overflow Sends AI Chip Orders to Intel and 4 Taiwan Firms
3 articles · Updated · Wccftech · Jul 12
Summary
TSMC’s advanced packaging bottleneck is pushing AI and HPC chip orders to Intel and Taiwanese providers ASE, SPIL, Powertech and KYEC as demand outstrips CoWoS capacity.
CoWoS has been the preferred packaging technology for years, but customers are now reserving capacity before new lines are even built, tightening supply for Nvidia, AMD, AWS and other major buyers.
Intel is using the squeeze to expand EMIB packaging and aims to become the No. 2 advanced-packaging provider, with reports saying Nvidia may shift next-generation Feynman GPU packaging orders there.
TSMC already runs 5 packaging and testing plants in Taiwan and is adding more capacity there, while planning 2 Arizona plants under its 12-fab U.S. expansion.