Apple Shifts A20 Pro to WMCM Packaging, Targeting 96-bit LPDDR6 AI Gains
Updated
Updated · Wccftech · Jul 5
Apple Shifts A20 Pro to WMCM Packaging, Targeting 96-bit LPDDR6 AI Gains
3 articles · Updated · Wccftech · Jul 5
Summary
Apple is reportedly replacing InFO-PoP with Wafer-Level Multi-Chip Module packaging on the A20 Pro, a design change aimed at easing thermal strain during on-device AI workloads.
WMCM separates DRAM from the chipset die instead of stacking memory on top, reducing heat buildup and improving bandwidth where PoP struggled with sustained AI and memory-intensive tasks.
A leaked A20 Pro logic board also pointed to a larger Neural Engine and a bigger vapor chamber, while the bandwidth lift could come from a move to 96-bit LPDDR6 from LPDDR5X.
The report frames AI as the trigger for the switch, but also suggests Apple may simply have hit the A-series' packaging limits after the A19 Pro, making the redesign a broader performance necessity.