Micron Commits $200 Billion to New Memory Fabs as Shortage May Last Beyond 2027

3 articles · Updated · CNBC · Jun 30

$200 billion in manufacturing and R&D will fund Micron’s push to ease a memory-chip shortage, including new fabs in Boise, Idaho, and Syracuse, New York.
Micron CEO Sanjay Mehrotra said years of customer-driven price pressure left the industry underinvested just before AI demand surged; Micron’s gross margin fell to negative 7.3% in fiscal 2023.
Boise is the most advanced project, with first chips expected in mid-2027 and the site eventually planned to house two fabs.
The squeeze is already reaching consumers: Apple last week raised prices on some Mac and iPad models after citing unavoidable jumps in memory and storage costs.
Mehrotra said the imbalance will likely persist well beyond 2027 because fabs take years to build and next-generation memory is becoming harder to manufacture.

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The $1 Trillion Memory Supercycle: How AI Demand and Micron’s Expansion Are Reshaping the Global Semiconductor Industry (2026–2027)

Overview

Micron is making major investments to boost U.S. semiconductor manufacturing, including building a second fabrication plant at its Boise, Idaho headquarters. This move is part of a broader strategy to strengthen America’s leadership in technology and ensure a resilient supply chain. At the same time, Micron is expanding its manufacturing presence in Asia to meet global demand. These efforts are driven by the rapid growth of AI, which is fueling unprecedented demand for memory chips. Micron’s advanced technology is now essential for powering data centers and high-performance computing, making the company a key player in the evolving tech landscape.

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