Updated

Updated · Wccftech · Jun 19

Qualcomm Adopts Samsung Heat Path Block for Snapdragon 8 Elite Gen 6 Pro as $300 Chip Runs Hot

Updated

Updated · Wccftech · Jun 19

Qualcomm Adopts Samsung Heat Path Block for Snapdragon 8 Elite Gen 6 Pro as $300 Chip Runs Hot

1 articles · Updated · Wccftech · Jun 19

Qualcomm has built Samsung-style Heat Path Block cooling into the upcoming Snapdragon 8 Elite Gen 6 Pro, but a tipster said the implementation is less effective than Samsung’s version.
The move targets persistent overheating concerns in recent Snapdragon flagships; Samsung’s Exynos 2600 uses a copper-based HPB heatsink that stays in direct contact with the application processor.
Two versions of the Snapdragon 8 Elite Gen 6 Pro are reportedly planned for Samsung’s Galaxy S27 line, not six, with the non-binned model estimated to cost more than $300.
That price could limit the standard Gen 6 Pro to top-end phones such as the Galaxy S27 Ultra, while other models may use the vanilla Snapdragon 8 Elite Gen 6 or a binned variant.
Samsung is already expected to move beyond HPB in the Exynos 2700 with a Side-by-Side design that places AP and DRAM dies horizontally under a shared copper heatsink.

Sources

With Qualcomm adopting older tech, will Samsung's Exynos chip finally outperform Snapdragon in the next Galaxy phone?

As AI and strikes drive up chip prices, how much more will the next flagship smartphones actually cost us?

Are escalating heat problems the final sign that we have reached the physical limits of traditional mobile chip design?

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