Huawei Says Mate 90 Kirin Matches TSMC 3nm Using DUV as LogicFolding Faces Test
Updated
Updated · Wccftech · Jun 16
Huawei Says Mate 90 Kirin Matches TSMC 3nm Using DUV as LogicFolding Faces Test
1 articles · Updated · Wccftech · Jun 16
Summary
Later this year, Huawei is expected to launch the Mate 90 with a Kirin chip reportedly delivering packaging and density comparable to TSMC’s 3nm process despite relying on DUV tools.
LogicFolding is central to that claim: Huawei says the architecture boosts transistor density generation by generation to offset its lack of EUV equipment under U.S. sanctions.
The report remains unproven, and that matters because earlier Kirin and SMIC advances were heavily touted while Huawei still appeared stuck at 7nm after the Kirin 9000S.
A Mate 90 debut around Apple’s iPhone 18 launch would make the phone Huawei’s clearest test yet in China, where it must pair chip gains with competitive features to defend share.