Xiaomi, Huawei Target H2 2027 LLW DRAM Rollout for Smartphones, Promising 1.5x AI Performance
Updated
Updated · Wccftech · Jun 15
Xiaomi, Huawei Target H2 2027 LLW DRAM Rollout for Smartphones, Promising 1.5x AI Performance
1 articles · Updated · Wccftech · Jun 15
Summary
H2 2027 is now the rumored launch window for Xiaomi and Huawei to bring Low Latency Wide DRAM to smartphones, a memory upgrade aimed at boosting on-device AI.
LLW is pitched as an HBM-like integrated design that avoids smartphones’ space and heat limits while addressing the performance bottlenecks of current LPDDR memory.
The rumor says LLW could deliver 1.5 times performance and cut power use by 50%, though the comparison baseline was not specified.
No faster memory upgrade is expected in 2026, suggesting Chinese handset makers still need another year before deploying AI-focused DRAM at scale.
The push reflects a broader race to improve handset AI hardware, with Huawei previously linked to smartphone HBM efforts and Qualcomm reportedly exploring 3D DRAM with Chinese memory suppliers.