Huawei Preps Mate 90 With 3D Cooling and New Kirin 5G Chip to Beat Moore's Law

1 articles · Updated · Zamin · Jun 10

Huawei's upcoming Mate 90 series is set to use a 3D heat-dissipation architecture that spreads heat across the phone vertically and horizontally, aiming to curb localized overheating.
The system reportedly replaces earlier MEMS-fan expectations with a liquid circuit driven by a micropump, using copper foil, graphene layers and the screen or back panel to shed heat.
Mate 90 is also expected to debut a new Kirin 5G chip built on Huawei's Logic Folding approach under its Tau scaling law, which the company says can push past Moore's Law limits.
A separate Mate 90 variant with an active fan is still possible, while Huawei is also developing accessories meant to raise zoom photography toward professional-camera levels.