Samsung has set up a dedicated team at its Production Technology Research Institute to study active liquid and air cooling for future Galaxy phones, aiming to curb thermal throttling under heavy workloads.
Park Min, who leads the lab, said the effort is centered on liquid cooling through a structure directly connected to the chipset, while air cooling remains under review despite fan noise and added weight.
The move goes beyond theory: Nubia already sells a gaming phone using both liquid and air cooling, and Oppo and Vivo have launched models with active air cooling.
Samsung already uses vapor chambers, and its Exynos 2600 adds Heat Pass Block technology that the report says runs cooler than Qualcomm's Snapdragon 8 Elite Gen 5.
Thermal management is becoming more critical as on-device AI and faster flagship chips push heat higher, though Samsung has not said which Galaxy model could debut the new system.
Can Samsung's liquid cooling solve AI overheating without making future Galaxy phones thicker or louder?
Is Samsung's active cooling a true innovation or a complex band-aid for its own underperforming chips?