Samsung Exynos 2600 HPB Beats Snapdragon 8 Elite Gen 5 Cooling in Thermal Tests

2 articles · Updated · Wccftech · May 29

Tests by Geekerwan found Samsung’s Exynos 2600 with Heat Pass Block sustained performance better than a Snapdragon 8 Elite Gen 5 cooled with liquid nitrogen, highlighting HPB’s practical thermal advantage.
HPB places a copper heatsink directly on top of the SoC die, addressing heat buildup worsened by Package-on-Package designs that stack DRAM over the chip and accelerate throttling.
The Galaxy S26+ still throttled under long gaming loads because its vapor chamber is less robust than the Galaxy S26 Ultra or iPhone 17 Pro Max, though a clip-on fan reportedly eased the problem.
That result could shape future flagship chips: a leaked Snapdragon 8 Elite Gen 6 Pro schematic points to HPB-like cooling, while Samsung’s rumored Exynos 2700 may move to side-by-side DRAM and CPU packaging.

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