Samsung May Drop FOWLP for Exynos 2700 as 23% Heat-Resistance Gain Comes Under Threat
Updated
Updated · Android Authority · May 15
Samsung May Drop FOWLP for Exynos 2700 as 23% Heat-Resistance Gain Comes Under Threat
3 articles · Updated · Android Authority · May 15
Samsung is reportedly considering removing Fan-Out Wafer-Level Packaging from the Exynos 2700, a move that could leave some Galaxy S27 and S27 Plus models running hotter next year.
FOWLP is said to be on the chopping block because the process is expensive and can hurt yields, even though Samsung previously credited it with a 23% single-core and 8% multi-core heat-resistance improvement on Exynos 2400.
To offset the change, the Exynos 2700 is expected to place DRAM beside the processor instead of stacking it, letting a heat-path block cover both components and improve cooling.
The shift extends Samsung's broader retreat from complex wafer-level packaging on flagship Exynos chips, prioritizing manufacturing economics as the company again tries to manage its long-running thermal challenges.
Will simplifying its flagship Exynos chip finally solve its infamous performance issues or just widen the gap with Snapdragon?
Is Samsung's pivot to a simpler chip design a tactical retreat or a masterstroke against its foundry rival TSMC?